Quicklogic ArcticLink可編程連接平臺(tái)設(shè)計(jì)方案

ArcticLink可編程連接解決方案平臺(tái)采用0.18um六層金屬CMOS工藝制造,內(nèi)核電壓為1.8V,I/O電壓可設(shè)定為1.8V,2.5V和3.3V. ArcticLink的邏輯單元為640個(gè),集成了高速USB 2.0 OTG控制器, SD/SDIO/MMC/CE-ATA主控制器, ASSP/FPGA接口,以及靈活的可編程架構(gòu),可編程I/O,非常低功耗模式和安全鏈接.本文介紹了ArcticLink主要特性, 解決方案平臺(tái)方框圖, 連接解決方案方框圖,以及各種USBOTG連接框圖，在汽車內(nèi)裝藍(lán)牙免提，智能手機(jī)，PND/PMP和ePOS的應(yīng)用框圖．

The QuickLogic ArcticLink Solution Platform is fabricated on a 0.18 μm, six layer metal CMOS process. The core voltage is 1.8 V. The I/O voltage input tolerance and output drive can be set as 1.8 V, 2.5 V, and 3.3 V.

ArcticLink 器件亮點(diǎn):

Hi-Speed USB 2.0 OTG Controller

• Single port OTG with embedded high-speed PHY

• Optional 12-signal ULPI interface

• Full-speed CEA-936-A mini-USB analog carkit interface

• Dedicated DMA controller

• High-speed up to 480 Mbits/sec.

SD/SDIO/MMC/CE-ATA Host Controller

• SD/SDIO 1-bit or 4-bit up to 52 MHz with Secure Digital High Capacity (SDHC) support

• CE-ATA 1-bit, 4-bit or 8-bit up to 52 MHz

• MMC 1-bit, 4-bit or 8-bit up to 52 MHz

• High-speed and flexible to support multiple storage options and SDIO peripherals

ASSP/FPGA Interface

• 8 Kbytes scratchpad memory

• Flexible Host interface for USB and SD/SDIO/MMC/CE-ATA ports

• DMA and power management functions

• Direct memory aperture for peripheral subsystems

Flexible Programmable Fabric

• 0.18 μm, six layer metal CMOS process

• 1.8 V core voltage, 1.8/2.5/3.3 V drive capable I/Os

• 36 Kbits of SRAM – seven dual-port 4-Kbit high performance SRAM blocks

• Embedded synchronous/asynchronous FIFO controllers

• One user configurable clock manager (CCM) (110-ball WLCSP and 196-ball TFBGA packages only)

• Up to 120 programmable I/Os available

• 100,000 system gates

• Nonvolatile, instant-on

• IEEE 1149.1 boundary scan testing compliant

Programmable I/O

• Bank programmable drive strength

• Bank programmable slew rate control

• Independent I/O banks capable of supporting multiple I/O standards in one device

• Native support for DDRIOs (196-ball package only)

• Bank programmable I/O standards: LVTTL, LVCMOS, and LVCMOS18

• Can be used for level shifter and I/O voltage translator

Very Low Power (VLP) Mode

• The QuickLogic ArcticLink Solution Platform has a special VLP pin which can enable a low power sleep mode that significantly reduces the overall power consumption of the device by placing the device in standby.

• Enter/exit VLP mode from/to normal operation in less than 250 μs (typical)

Security Links

There are several security links to disable JTAG access to the device. Programming these optional links completely disables access to the device from the outside world and provides an extra level of design security not possible in SRAM-based FPGAs.

JTAG

QuickLogic ArcticLink Solution Platform supports IEEE 1149.1 boundary scan or post-manufacturing testability. External access to this feature can be completely disabled.

ArcticLink QL1A100主要特性列表:


圖1.ArcticLink 解決方案平臺(tái)方框圖

圖2.ArcticLink 連接解決方案方框圖
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圖3.QL1A100和USB 1.1與OTG的連接框圖

圖4.QL1A100和ULPI HS PHY/USB 1.1串行收發(fā)器的連接框圖

圖5.QL1A100和Philips PDIUSBP11A 與ULPI 3引腳收發(fā)器的連接框圖

圖6.ArcticLink在汽車內(nèi)裝藍(lán)牙免提應(yīng)用框圖

圖7.ArcticLink在智能手機(jī)應(yīng)用框圖

圖8.ArcticLink在PND/PMP應(yīng)用框圖

圖9.ArcticLink在ePOS應(yīng)用框圖