德州儀器300-mm RFAB晶圓廠內(nèi)部首曝光【上】

時(shí)間：2011-07-09 23:46:14

關(guān)鍵字：晶圓廠 RF FAB

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[導(dǎo)讀] 　　【 21ic電子網(wǎng) 編譯/David 】：作為少數(shù)被邀的幾家媒體代表之一，最近收到來自德州儀器公司（Texas Instruments Inc.）的邀請函，有幸參加了RFAB—德州儀器旗下新開的在半導(dǎo)體工業(yè)首家300-mm模擬晶圓

　　【 21ic電子網(wǎng) 編譯/David 】：作為少數(shù)被邀的幾家媒體代表之一，最近收到來自德州儀器公司（Texas Instruments Inc.）的邀請函，有幸參加了RFAB—德州儀器旗下新開的在半導(dǎo)體工業(yè)首家300-mm模擬晶圓廠，并為全球首家通過LEED（Low Energy Electron Diffraction，是美國民間綠色建筑認(rèn)證獎(jiǎng)項(xiàng)）認(rèn)證的晶圓廠。

　　RFAB最初在2004年正式破土動(dòng)工，并于2007年竣工。但是，該晶圓廠足足延遲閑置了兩年多，直至德州儀器遇到性價(jià)比非常高的收購—因?yàn)殚W存芯片廠商Qimonda AG宣布破產(chǎn)，整條300-mm設(shè)備產(chǎn)品線以非常低的折扣價(jià)率，只有1.725億美元，德州儀器便順利收購該產(chǎn)品線。

　　據(jù)Paul James Fego，德州儀器技術(shù)與制造全球副總裁表示，如果沒有Qimonda設(shè)備收購案的話，RFAB到現(xiàn)在可能就只有一條200-mm產(chǎn)品線模擬晶圓廠。 “我們擁有硬件設(shè)施建設(shè)，我們便擁有設(shè)備儀器的機(jī)會(huì)，”他說，“我們當(dāng)時(shí)便已意識(shí)到，300-mm將會(huì)是未來的主宰。”

TI‘s 1.1-million square foot RFAB includes about 250，000 square feet of cleanroom space.　

德州儀器1.1百萬平方英尺的RFAB晶圓廠，包括25萬平方英尺無塵凈化室

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　　正在走向全面生產(chǎn)

The area of RFAB nearest the observation window includes more than a dozen process tools， including ion implantation systems made by Axcelis Inc. and Varian Semiconductor Equipment Associates Inc.

在靠近RFAB觀察窗口，可以看到不少于12臺(tái)相關(guān)操作設(shè)備，包括Axcelis Inc. and Varian Semiconductor Equipment Associates制造的離子移植系統(tǒng)

　　在2009年9月幾周內(nèi)，德州儀器通告300-mm模擬產(chǎn)品晶圓廠將正常營業(yè)，當(dāng)時(shí)，Qimonda的設(shè)備已經(jīng)被運(yùn)到德州的Richardson市，距德州儀器總部和Dallas晶圓廠集中地也就只有幾英里。Tom Weichel，RFAB晶圓廠經(jīng)理。（Weichel說，在RFAB辦公室的內(nèi)部，甚至連家具或辦公設(shè)施都是來自于Qimonda）。

　　在上一年，RFAB已經(jīng)實(shí)現(xiàn)全面生產(chǎn)。晶圓廠的所有設(shè)施，包括占地25萬平方英尺的凈化室，目前產(chǎn)能在350片晶圓每天，將在2011年底實(shí)現(xiàn)600到700片日均產(chǎn)能，據(jù)德州儀器發(fā)言人宣稱。

未完待續(xù)...

原文：Photo gallery： Inside TI‘s RFAB

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　　Representatives from Texas Instruments Inc. last week invited a few members of the media to Richardson， Texas， for a tour of RFAB—the semiconductor industry’s first 300-mm analog fab and first LEED certified fab.

　　TI originally broke ground on the shell for RFAB in 2004. Work was completed by 2007， but the shell sat idle for more than two years until TI happened on a sweetheart of a deal—scooping up a boatload of 300-mm production equipment from bankrupt memory chip vendor Qimonda AG for the deeply discounted rate of $172.5 million.

　　According to Paul James Fego， vice president of worldwide manufacturing for TI‘s Technology and Manufacturing group， RFAB would have been a 200-mm analog fab—if not for the deal that was available on the Qimonda equipment. “We had the building built， we had an equipment opportunity，” he said. “And we knew the breadth and the volume of our analog business could fill a 300-mm fab.”

　　Ramping toward full production

　　Within weeks of the September 2009 announcement that TI planned to open the first 300-mm analog fab， the Qimonda equipment began arriving in Richardson， just a few miles north of TI’s headquarters and a cluster of TI fabs in Dallas. Tom Weichel， manager of RFAB. （Weichel said even the furniture in RFAB‘s office space came from Qimonda）。

　　RFAB started ramping toward full production at the end of last year. The facility， which includes about 250，000 square feet of cleanroom space， is currently running about 350 wafers per day， ramping to between 600 and 700 wafers per day by the end of 2011， according to a TI spokesperson .

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